Multi-chip module

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A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dice and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dice all on the same module. Multi-chip modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a high density interconnection (HDI) substrate. The final assembled MCM substrate may be done in one of the following ways: The ICs that make up the MCM package may be: An interposer connects the ICs. This is often either organic (a laminated circuit board that contains carbon, hence organic) or is made of silicon (as in High Bandwidth Memory). Each has advantages and limitations.